ON Semiconductor to Introduce MicroLeadless Package Devices for Size-Critical Applications Monday 21 May 2001 PDF Print New manufacturing platform to pave the way for ultra-small packages that maintain industry-leading performance ON Semiconductor (Nasdaq: ONNN) today announced that it plans to introduce a new manufacturing platform capable of producing a wide range of ultra-small, low-cost leadless packages to address the space and performance needs of wireless, networking and consumer electronic applications. Using a versatile manufacturing flow that incorporates processes taken from ON Semiconductor's high volume SOT-series and SC-series production lines, the new MicroLeadless family of packages provides improved thermal and RF performance in a footprint that is typically one-fourth the area of leaded surface mount packages. ON Semiconductor currently plans to introduce two-leaded and three-leaded versions as small as 1.0 mm by 0.6 mm for diodes and transistors. The company is also designing versions with eight or more leads in a 2.0mm by 2.0mm size for more complex devices such as ON Semiconductor's broadband, analogue, logic or micro-integration ICs. The manufacturing concept is extremely flexible, offering the possibility for unique and optimised physical configurations depending on customer need. "It is clear that leadless packages will be the packages of choice for designers of next generation electronic devices," said Collette Hunt, vice president and general manager of the Bipolar Discrete Business Group at ON Semiconductor. "The transition to leadless packaging will be on a scale similar to that which occurred when through-hole products gave way to surface mount, space considerations make that inevitable." Alistair Banham, president and general manager of Europe, Middle East and Africa for ON Semiconductor stated, "We chose to announce this new package platform here in Europe due to the large number of key customers in the region that are requiring ON Semiconductor's leading-edge miniature packages. The initial response to the MicroLeadless platform has been resoundingly positive. We plan to justify that support through diligent attention to our customer's needs." The company is accepting inquiries for product samples in various configurations now, and expects to begin volume production by December 2001. About ON Semiconductor ON Semiconductor (Nasdaq: ONNN) is a global supplier of high-performance broadband and power management integrated circuits and standard semiconductors used in numerous advanced devices ranging from high-speed fibre optic networking equipment to the precise power management functions in today's advanced portable electronics. For more information visit ON Semiconductor's Web site at http://www.onsemi.com. Media Contacts: Geert de Vuyst ON Semiconductor (33)-0534-611-390 Geert.De.Vuyst@onsemi.com Or Jonathan Batty/Joanna Lane Brodeur Worldwide (On behalf of ON Semiconductor) (44) (0)1753-790-700 email@example.com / firstname.lastname@example.org ______________________________________________________________________ Click on the link below to see this news release as it appears on the Brodeur News Room website and obtain full contact details. http://www.brodeurnewsroom.com/asp/release.asp?rid=1505&cid=... ______________________________________________________________________ Click the link below to login and update your company and subject preferences, or personal details. http://www.brodeurnewsroom.com/asp/login.asp ______________________________________________________________________ Click on the link below to have your login details re-sent to you. http://www.brodeurnewsroom.com/asp/forgot.asp ______________________________________________________________________ This press release was distributed by ResponseSource Press Release Wire on behalf of Pleon in the following categories: Consumer Technology, Personal Finance, Business & Finance, Computing & Telecoms, for more information visit https://pressreleasewire.responsesource.com/about.