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POST cti, a Value Added Distributor of standards-based communications products, announces today that it has signed a UK distribution agreement with AMTELCO, a leading US-based manufacturer of analogue and digital PC telephony boards. AMTELCO telecom boards are typically used by developers, system integrators, service providers and telcos.

The agreement will bring AMTELCO’s award-winning XDS MC-3 Multi-Chassis Interconnect boards to the UK market for the first time. Designed for large system builds where the required capacity cannot be accommodated within a single PC chassis, AMTELCO’s Multi-Chassis Interconnect boards allow developers to connect multiple PC chassis into a single system, with full communications between all chassis. This capability is particularly relevant to the large community of developers working with Intel® Dialogic® or Intel® Netstructure™ boards on the Windows® operating system using Intel® System Release 5.1.1 Feature Pack 1. Because while Feature Pack 1 allows multiple boards to share resources across the CT Bus, Intel® offers no mechanism today for sharing the CT Bus across multiple servers. AMTELCO’s XDS MC-3 Multi-Chassis Interconnect boards are available in H.110 CompactPCI and H.100 PCI form factors.

POST will also supply other AMTELCO XDS products, including telephony interface boards, conferencing boards, BRI boards and analogue port boards.

AMTELCO’s range of open architecture XDS boards allow customers to take full advantage of the capabilities of different systems and networks, while insulating them from the details of network operation via field-proven firmware. XDS boards can be interfaced to various interconnect buses, both public and proprietary, and can be connected to boards from other companies within a single system. AMTELCO supports many bus architectures and form factors including H.110 CompactPCI, H.100 PCI, MVIP, and SCSA.

About Amtelco


AMTELCO was founded in 1976. Since its inception, AMTELCO has been a leader in call centre and telephony innovations. These innovations led to the XDS CTI Boards Division in 1980. The AMTELCO XDS Division designs, manufactures, and markets telephony interface boards, conferencing boards, multi-chassis interconnection boards, BRI boards, and analogue port boards in a variety of formats (MVIP, SCSA, H.100 PCI, and H.110 CompactPCI). AMTELCO XDS also modifies these boards for special applications. Developers and specialised computer and telephony board manufacturers worldwide utilise XDS technology to produce state of the art solutions for central offices, call centres, wireless switching platforms, and conferencing platforms.



Formed in 1997, POST CTI is a Value Added Distributor (VAD) of standard-based communications building blocks from leading manufacturers such as Intel, Envox, HP, Scansoft and Nuance. POST CTI is the only VAD of Intel® Telecom Products in the UK and the largest VAD for Intel telecom products in EMEA.

POST CTI provides Value Added Resellers, Systems Integrators and Developers with a single convenient source for communications technologies. In addition to providing a broad and competitively-priced product selection, the company offers custom system integration services and advice, finance options, sales training and marketing/technical educational seminars.

For further enquiries please contact:

Nik Robinson, POST CTI Tel: 0870 1266633 email:

Michael Gray, Gray Associates Ltd. Tel: +44 (0) 20 8744 9168 email:

This press release was distributed by ResponseSource Press Release Wire on behalf of Gray Associates in the following categories: Consumer Technology, Personal Finance, Business & Finance, Computing & Telecoms, for more information visit