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Kallastra, a PCI/cPCI board manufacturer for VoIP, Host Media Processing and Multi-Chassis markets, today announced that C3, a leading supplier of technology platforms for voice processing applications, has selected Kallastra's KeyTrunk300 card for their Multi-Chassis interconnect solution.


The KeyTrunk300 Series offers a very cost-effective, high-density board solution for interconnection of Computer Telephony (CT) chassis. By interconnecting multiple chassis together, single chassis limitations in terms of I/O slots, TDM timeslots, and system capacity can be overcome. In particular, by using Ethernet-based technology, the KeyTrunk300 Series offers a completely scalable system where any number of chassis can be interconnected together.


"We are very pleased with the KeyTrunk300 Series card as it has allowed us to rapidly switch over to a new multi-chassis solution with minimum software and integration effort" explains Wayne Starsmore, Technical Director at C3.


"Kallastra's boards offers us a completely scalable solution, as well as a smooth migration to IP-based networks".


"Kallastra has been working very closely with C3's engineering team, and has been able to deliver and support the products with the features that C3 needs to grow and expand their systems" said Frederic Dickey, Director of Sales and Marketing at Kallastra. "We have been happy to work with C3 and demonstrate the robustness of the Kallastra product, and deliver the features that allow C3 to have a competitive edge in today's market".


The KeyTrunk300 Series provides a scalable solution for open CT systems, and is capable of processing between 128 and 2,016 channels per board. By using a specialised mode where multiple TDM streams are dynamically mapped into single packets, the KeyTrunk300 Series offers an extremely low-latency connection between computer chassis, typically 1 to 2 ms. The KeyTrunk300 Series supports standard TDM bus interfaces as well dual Ethernet ports.


About Kallastra

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Kallastra designs, develops and markets Voice over Packet processing boards for the computer telephony market, telecommunication infrastructure as well as enterprise applications. Kallastra has a strong background in Voice over Packet designs; and this expertise is harnessed to create scalable TDM to Packet solutions.


Kallastra's products are used in several applications such as RTP multi-chassis interconnection, host media processing systems, and IP trunking. Kallastra also provides ancillary media processing capabilities with its Voice over Packet boards.


For more information about Kallastra and its products, please visit

www.kallastra.com, or email info@kallastra.com


About C3

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C3 Ltd is Europe's leading supplier of technology communications platforms for call handling and e-business. The company has installed over 250,000 lines of communications technology for corporates and service providers since 1990. Applications include: prepaid telephony, emergency call out, IVR, speech recognition, contact centre, virtual call centre, voicemail, automated solutions, SMS, IdTV, VoIP and Status Messaging. C3 is based in Cambridge UK and is a member of the Network for Online Commerce (www.noconline.org).


Press Contact:


Marc Gagnon, Communications Manager, Kallastra Tel: +1 514 282 8882

email: marc.gagnon@kallastra.com


Sue Hunt, Marketing, C3 Tel: + 44 (0) 1223 427729

email: susan@c3ltd.co.uk



This press release was distributed by ResponseSource Press Release Wire on behalf of Gray Associates in the following categories: Consumer Technology, Personal Finance, Business & Finance, Computing & Telecoms, for more information visit https://pressreleasewire.responsesource.com/about.