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Today’s announcement of the Approved Release 1.0 of BONDI from OMTP shows the continued evolution and maturity of the BONDI initiative. With a strong membership support for this new release, OMTP expects to see BONDI compliant devices in the market during 2010.

The BONDI initiative, which only started life in mid 2008, is driving a consistent set of web APIs with an underlying security model on mobile devices. This will enable web applications and widgets to access capabilities provided by the underlying platform and terminal (e.g. use of the camera, location or contact details) which will work across a wide range of different devices, platforms and operators. Developers will truly benefit from these enhanced features and consistent environments, driving availability of attractive applications which in turn will be of high value to consumers.

The BONDI 1.0 release comes at the same time as the approval of release 2.0 of the LiMo platform specification which includes support for the BONDI browser and runtime frameworks, meaning that LiMo R2 handsets with web runtimes will be able to support web applications and widgets that can be easily created with common web authoring tools.

“It is great to see that through the successful cooperation between operators, terminal vendors, application developers and industry organisations, BONDI 1.0 is now released and increasingly adopted. Providing more functionality for web applications as well as a security layer, and these consistently across platforms and devices, BONDI facilitates the whole value chain and will drive mobile usage. BONDI APIs are becoming an integral part of the T-Mobile Terminal Requirement Specifications and T-Mobile will remain committed as BONDI moves forward" states Arnd Gallmann, Senior Vice President Terminal Technology, at T-Mobile International.

“This is a first and extremely important step towards a world-wide common framework of mobile web 2.0 that will boost mobile innovation. Uncoupling the development of applications from the specifics of the devices will significantly boost innovation by enabling all customer segments to benefit from application innovation” – said Luca Tomassini, Telecom Italia’s Executive Vice President for Business Innovation - “The recent approval of BONDI 1.0 specification, that Telecom Italia has actively promoted and significantly contributed to, is a first and significant step in the direction of supporting the developing ecosystem”.

“Telefónica is excited that BONDI continues to make great progress towards commercial deployments, with the approval of BONDI Release 1.0 and its inclusion in Release 2.0 of the LiMo Platform” said Carlos Melendo, Director of Handsets and Smartcards at Telefónica Spain. “The work to deliver BONDI 1.0 has been a great example of how different companies can pull together to create something incredibly positive for our customers, for developers and for the industry as a whole”.

“The BONDI Approved Release 1.0 is the result of a large amount of effort by the OMTP Members and Participants together with the wider community through the use of an open source approach” said Tim Raby, Managing Director of OMTP. “This release provides a solid basis upon which we will see commercial implementations of BONDI on real devices in the coming year”.


About OMTP
OMTP is a forum funded by companies from across the mobile phone value chain, set up with the aim of gathering and driving mobile terminal requirements to ensure consistent and secure implementations, thereby reducing fragmentation and simplifying the customer experience of mobile data services across mobile terminals. OMTP is backed by many of the largest mobile operators and has members from hardware and software vendors across the value chain. For more information, visit

For further information regarding the OMTP, please contact:
Sarah Bedwell
Tel. +44 1628 502601

This press release was distributed by ResponseSource Press Release Wire on behalf of MUSTARD PR in the following categories: Business & Finance, Computing & Telecoms, for more information visit