Transense Technologies plc, a UK developer of Surface Acoustic Wave (SAW) torque and temperature sensing systems, has signed a new licensing and supply agreement with ISI Interconnect Systems, a Molex company, to support the packaging and distribution of its proprietary SAW Application Specific Integrated Circuit (ASIC) technology in the United States.
The agreement follows more than 12 months of technical and commercial development with ISI and marks a significant milestone in Transense’s expansion within the US defence and aerospace sectors.
Under the terms of the agreement, ISI will carry out final device packaging at its advanced semiconductor facility in Camarillo, California. The packaged ASICs will then be supplied by ISI to end customers within the US, creating a domestic supply chain for Transense’s specialist technology.
Developed by Transense, the ASIC is a key component in SAW torque and temperature sensor systems and is...
