Boston are once again at the forefront of HPC technology with the launch of our Quattro 12256-T featuring the latest Intel® Xeon® Phi™ Processor
Frankfurt, Germany (June 21, 2016) – Boston Limited unveiled the Boston Quattro 12256-T featuring the latest generation Intel® Xeon® Phi™ processor at ISC 2016 in Frankfurt, Germany.
The Quattro 12256-T leverages Intel’s 2nd generation Intel® Xeon® Phi™ product family (formerly code named Knights Landing) to deliver massive thread and data parallelism and memory bandwidth, improved single-thread performance and Intel® Xeon® processor binary-compatibility all within a standard CPU form factor. In addition to this, the new chip provides 64-core per processor with up to 4 threads per core. A total of 256 threads per processor are compatible with software compiled for existing x86 hardware.
“Boston are once again at the forefront of HPC technology with the launch of our Quattro 12256-T featuring the latest Intel® Xeon® Phi™ Processor. Our mission is to provide customers with the best of breed technologies and this launch helps us to achieve that” said Manoj Nayee, Managing Director, Boston Ltd.
As a member of the Boston Quattro range, the Quattro 12256-T has a multi-node design which offers 4 independent compute nodes based on the same Intel® Xeon Phi™ processing technology. Each node has multiple HDD/SSD support, independent platform management, redundant and optimised cooling, and titanium-level redundant power supplies.
Coupled with optional Intel® Omni-Path fabric connectivity directly from the CPU die, the Quattro 12256-T offers a truly integrated, high performance and low latency compute platform with a convergence of the very latest in processing and networking technologies. This offering will accelerate HPC in a variety of use cases which include the public sector, energy, life sciences, financial services and engineering.
In order to kick start Knight’s Landing for early developers, Boston Limited have a low cost pedestal solution with a single node. For more information, please contact firstname.lastname@example.org.
For further information, including product details and specifications, please contact:
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Notes to editors:
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